COOLING MODELING, USING LIQUID BOILING FOR HEAT TRANSFER INTENSIFICATION AT CRITICAL CONDITIONS IN MICROELECTRIC DEVICES

Анотація

The paper considers non-stationary, non-linear model of heat exchange process in microelectronic devices, using liquid boiling for heat transfer intensification in critical conditions. For the analysis of the model the set of numerical methods has been used that enabled to obtain solution in numerical form. On the basis of constructed model temperature change and variation of heat fluxes, removed form the surface of the device in time and impact of boiling process on heat transfer is investigated.