1.
Fedasiuk D, Mukha T. COOLING MODELING, USING LIQUID BOILING FOR HEAT TRANSFER INTENSIFICATION AT CRITICAL CONDITIONS IN MICROELECTRIC DEVICES. Scientific Works of Vinnytsia National Technical University [інтернет]. 29, Листопад 2015 [цит. за 13, Травень 2026];(4). доступний у: https://works.vntu.edu.ua/index.php/works/article/view/315