FEDASIUK, D.; MUKHA, T. COOLING MODELING, USING LIQUID BOILING FOR HEAT TRANSFER INTENSIFICATION AT CRITICAL CONDITIONS IN MICROELECTRIC DEVICES. Scientific Works of Vinnytsia National Technical University, [S. l.], n. 4, 2015. Disponível em: https://works.vntu.edu.ua/index.php/works/article/view/315. Acesso em: 19 apr. 2024.